Aluminum Nitride （ALN）Ceramics

Features

Standard thermal conductivity 175 W/m·k, ultra-high thermal conductivity>200W/m:K.
Provide customized services, can be customized grinding type, instant burning type, high bending resistance, high thermal conductivity, polishing type, laser marking type
Wait for the substrate.
Suitable for a variety of different metallization: DPC, DBC, TPC, AMB, thick film printing, film printing, etc.
The thinnest thickness can reach 0.10mm.

Typical technical data

NC-170

Color: Gray/Beige
Density: ≥3.24g/cm3 (at room temperature)
Thermal conductivity: ≥170 W/m·k (20℃)
Bending strength: >450 MPa (at room temperature)
Surface roughness: <0.8µm (at room temperature) Warping degree <2.5 ‰ (at room temperature) Linear expansion coefficient: 4.6 X 10^(-6)/k (300℃) Volume resistance: >10^13Ω·cm (20℃)
Dielectric constant 1MHz: 10.6 (at room temperature)
Dielectric loss 1MHz: 4.6×10^(-4) (at room temperature)
Dielectric strength: ≥20 KV/mm (at room temperature)

NC-200

Color: Gray/Beige
Density: ≥3.24g/cm3 (at room temperature)
Thermal conductivity: ≥195 W/m·k (20℃)
Bending strength: >350 MPa (at room temperature)
Surface roughness: <0.8µm (at room temperature) Warping degree <2.5 ‰ (at room temperature) Linear expansion coefficient: 4.6 X 10^(-6)/k (300℃) Volume resistance: >10^13Ω·cm (20℃)
Dielectric constant 1MHz: 10.6 (at room temperature)
Dielectric loss 1MHz: 4.6×10^(-4) (at room temperature)
Dielectric strength: ≥20 KV/mm (at room temperature)

Application

Aluminum nitride powder has high purity, small particle size and high activity. It is the main raw material for the manufacture of high thermal conductivity aluminum nitride ceramic substrates.
Aluminum nitride ceramic substrate is an ideal heat dissipation substrate and packaging material for large-scale integrated circuits.
Using AIN ceramics’ heat resistance, melt erosion resistance and thermal shock resistance, GaAs crystal Gan collapse, AI evaporative blood, magnetic fluid power generation device and corrosion-resistant parts of high-temperature permeable sub-machine can be made.

Typical technical data

Color: Gray/Beige
Density: <2.5g/cm 3 (at room temperature) Thermal conductivity: ≥170 W/m·k (20℃) Bending strength: >350Mpa (at room temperature)
Surface roughness: 0.02-0.7µm (at room temperature)
Warping degree: <2.5‰ (at room temperature)
Linear expansion coefficient: 4.6X10^(-6)/k (300℃)
Volume resistance: 1.5×10^13Ω·cm (20℃)
Dielectric constant 1MHz: 10.6 (at room temperature)
Dielectric loss 1MHz: 4.6×10^(-4) (at room temperature)
Dielectric strength ≥20 KV/mm (at room temperature)

Application

Make crucibles, muffle furnaces, burners, heating fixtures, molds, aluminum conduits, and thermocouple protection in the metallurgical industry.
Parts on thermal equipment such as casing, aluminum electrolytic cell lining, etc.
Make high-speed turning tools, bearings, metal parts heat treatment support parts, rotor engine scrapers, and combustion tools in the machinery manufacturing industry.
Air turbine guide blades, turbine blades, etc.
It is used as a ball valve, pump body, sealing ring, filter, heat exchanger component, fixed catalyst carrier, and combustion in the chemical industry.
Ships, evaporation dishes, etc.
In semiconductor, aviation, atomic energy and other industries, it is used to manufacture switching circuit substrates, film capacitors, and electrical insulators.
Radar wire cover, missile tail nozzle, support and isolation parts in atomic reactors, nuclear fission carrier.
Artificial joints can be used in the pharmaceutical industry.